Sapphire ultra-thin wafers, substrates and windows
The thinnest Sapphire wafers and parts can be made from A-plan  orientation. Thinness of 10 microns (0.0004") has been achieved, but not easily.
With R-plane  sapphire orientation, a realistic thickness for wafers and substrates is in the 100 to 125 micron range (0.004 to 0.005").
Size is not a real limitation for thin wafers and substrates. Parts 12½" x 2½" x 0.0035" have been produced in polished Sapphire.
Depending on orientation, the best surface finish of a few Angstroms is attainable and for these finishes, measurements are made on WYKO non-contact interferometer.
Other Sapphire related services provided include edge-angle polishing, wafer thinning and dicing.
Available from stock are A-plane sapphire wafers to thinness of 0.001" (25 microns) and in R-plane sapphire wafers, starting at 0.005" (125 microns).
Sapphire wafer and substrate related Web sites:
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Updated: 14 June 2012