MEMS Thinning and Ultra-Thin Silicon Wafers

MEMS Thinning

MEMS Micro Electro-Mechanical Systems can contain small mechanical, optical and electronic elements produced by litographic techniques. Valley stocks and processes many of the materials, including ultra thin, for use in these applications.

Silicon-Direct-Bonding (SDB) or Wafer-Direct-Bonding (WDB) also referred to as Fusion Bonding is accomplished when smooth and flat Silicon surfaces are brought together at high temperature. High quality surface finishes (<10A), when required, are provided by Valley Design.

Anodic Bonding, also referred to as Electrostatic Bonding, is a process where glass to Silicon or a metal is permanently attached with an irreversible chemical bond. This is accomplished with heat and high voltage.

SOI Silicon-On-Insulator refers to a thin layer of Silicon on top of an insulating layer such as glass or Silicon Oxide.

For answers to your complex technology needs, come to the company that has been a leader in advanced and ultra thin materials processing for nearly 30 years. Valley had pioneered the innovative techniques used to produce the substrates and components for MEMS and many other applications. Valley also stocksmany of these materials.

Additional information on MEMS and other related processes:

• www.customdicing.com/bonded-wafers.htm Dicing bonded wafers
• www.valleydesign.com/semi-wafers.htm Polished glass wafers and substrates to SEMI standards
• www.sensorsmag.com Silicon wafer bonding
• www.siliconwafers.net/thinned.htm Silicon wafers thinned to produce thinner dice-chips
• www.quartz-silica.net Fused Silica substrates and wafers
• www.edgepolishing.com/die-thinning.htm Wafer and die thinning technology
• www.customdicing.com/thin-dice.htm Thin dice by thinning after dicing

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