· Thin dice by thinning wafer after dicing:
www.customdicing.com/thin-dice.htm 
Thinning dice after dicing has advantages over thinning wafers prior to singulating. Less cracking, lower stresses, choice of surface finish on backside, and tighter thickness tolerances.
· Thinning and polishing Anodic Bonded wafers for MEMS:
www.siliconwafers.net/cmp-soi.htm 
Bonded wafers including silicon on silicon, silicon on SiC, silicon on glass, silicon on sapphire, MEMS, SOI, anodic or any other combination thinned and polished to micron tolerances.
· Silicon wafers thinned to produce thinner dice (chips):
www.siliconwafers.net/thinned.htm 
Bumped silicon wafers, chips and all other semiconductor material wafers and singulated die thinned-backlapped to any thickness.
· Thinning of silicon and GaAs wafers, substrates and dice:
www.valleydesign.com/pr17.htm 
Polished thin silicon and gallium arsenide wafers from the experts - Valley Design.
· Silicon lapping, backlapping and thinning services:
www.valleydesign.com/pr28.htm 
Precision lapping and backlapping of silicon and other semiconductor materials in prototype and production quantities are offered Valley Design.
· Polished optical windows and substrates, also ultra-thin:
www.valleydesign.com/pr31.htm 
Polished optical soda lime glass windows, substrates, wafers and plates are available from stock as thin as 0.002 in.from Valley Design Corp.
· Polished sapphire substrates, ultra thin:
www.valleydesign.com/pr33.htm 
Polished ultra thin sapphire is available in all sizes and thicknesses as substrates, wafers, windows and dice from Valley Design Corp.