Related Pages

Related Pages

  • Thin dice by thinning wafer after dicing:
    Thinning dice after dicing has advantages over thinning wafers prior to singulating. Less cracking, lower stresses, choice of surface finish on backside, and tighter thickness tolerances.
    www.customdicing.com/thin-dice.htm
  • Thinning and polishing Anodic Bonded wafers for MEMS:
    Bonded wafers including silicon on silicon, silicon on SiC, silicon on glass, silicon on sapphire, MEMS, SOI, anodic or any other combination thinned and polished to micron tolerances.
    www.siliconwafers.net/cmp-soi.htm
  • Silicon wafers thinned to produce thinner dice (chips):
    Bumped silicon wafers, chips and all other semiconductor material wafers and singulated die thinned-backlapped to any thickness.
    www.siliconwafers.net/thinned.htm
  • Thinning of silicon and GaAs wafers, substrates and dice:
    Polished thin silicon and gallium arsenide wafers from the experts - Valley Design.
    http://www.valleydesign.com/ultra-thin-silicon.htm
  • Silicon lapping, backlapping and thinning services:
    Precision lapping and backlapping of silicon and other semiconductor materials in prototype and production quantities are offered Valley Design.
    http://www.valleydesign.com/silicon-lapping-service.htm
  • Polished optical windows and substrates, also ultra-thin:
    Polished optical soda lime glass windows, substrates, wafers and plates are available from stock as thin as 0.002 in. from Valley Design Corp.
    http://www.valleydesign.com/solime.html
  • Polished sapphire substrates, ultra thin:
    Polished ultra thin sapphire is available in all sizes and thicknesses as substrates, wafers, windows and dice from Valley Design Corp.
    http://www.valleydesign.com/sapphire.htm

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